One of the big questions right now is motherboard support. PCIe Gen 3.0 x16 PEG (x16 or x8 + x8) + x4 M.2 + x4 Chipset The table below is a list of the third-generation Ryzen desktop CPU lineup: Specifications below supplied by AMD: CPU Windows 10 is the officially supported platform for the Ryzen CPUs however it does appear as if Windows 7 installations will again be possible with the right drivers for those still hanging on or competitive benchmarking where every clock cycle available counts. That has all changed now with the changes AMD has made to the controller and how the controller frequency and fabric clock can now decouple. The memory situation with Ryzen has improved steadily as the BIOS matured but it was still a finicky platform. Again I observed fairly high frequencies during stress testing with all cores hovering between 4.05 GHz and 4.1 GHz, slightly higher than the 2700X. The Ryzen 7 3700X has a base frequency of 3.6 GHz and a maximum boost of 4.4 GHz with a 65 W TDP. During stress testing, I noticed an all core, heavy load situation, a boost clock which hovered between 4.05GHz and 4.1 GHz. The Ryzen 9 3900X has a base frequency of 3.5 GHz and a maximum boost of 4.6 GHz with a 105 W TDP. Both CPUs are equipped with 32 MB shared 元 Cache per CCD and 512 KB L2 Cache per core. AMD is still using solder between the die and IHS on the Ryzen CPUs for improved thermal transfer. There’s also a 12 nm IO/memory controller on the package with 2.09 Billion transistors on a 125 mm² die. Looking at the specifications table below, we see the new Ryzen CPU is produced using the 7 nm process from TSMC foundries and has 3.9 billion transistors on a 74 mm² die per CCD. In the DIE shot below you can clearly see the two core dies and the IO die with the Infinity Fabric routings tying it all together. Another benefit of using chiplets, is the process allows for better yields and improved density which all amounts to lower consumer costs and likely high profits.īelow we can see a block diagram of a typical two CCD plus IOD package such as the 3900X: You simply add another CCD to increase the core count of the package or possibly even a NAVI based GPU chiplet in the future? Regardless, it gives AMD the opportunity to make monstrous 64-core/128-thread HEDT and server CPUs all based on the same CCDs. Here’s a block-level diagram giving an overview of the ZEN2 core architecture:ĪMD’s idea of bringing it all together into one package allows for so much flexibility. New hardware mitigation against speculative store bypass (Spectre V4), expanding the strong security profile of ZEN+.A larger 180-entry register file, providing more immediate access to more working data.Improved SMT fairness for ALU and AGU schedulers, reducing thread contention and throughput.Improved fetch and prefetch capabilities, arming the execution engines more readily with needed data.Doubled 元 cache size to 32 MB per CCD, which reduces effective memory latency by up to 33 ns–excellent for games.A third address generation unit (AGU), which keeps the execution engine more reliably fed with data in DRAM.New TAGE branch predictor, with larger L1 and L2 BTBs, to increase throughput by reducing stalls from mispredicts.
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